Advanced Packaging Technology for Immersion-tin-layer-coated IC Cu Pillar Bumps on an Immer sion-tin Substrate

Advanced Packaging Technology for Immersion-tin-layer-coated IC Cu Pillar Bumps on an Immer sion-tin Substrate

The electronic industry related to the semiconductor has grown with an amazing rate since the 20th century, and its performance is amazingly brisk. In Taiwan, the development of the electronic industry and its associated industries are more flourishing among all sectors. Interestingly, electronic packaging industry becomes more important due to the fact that the need for lighter, smaller and thinner 3C products with multi-function are in great demand. Electronic packaging industry mainly deals with the packaging of active components (such as microprocessor, dynamic random access memory, etc.) and passive components(such as capacitor, inductor, and resistor) with a ceramic substrate (or an organic substrate).