超快雷射於半導體封裝異質材料微加工之應用

Application of Ultrafast Laser on Micromachining of Hybrid Materials in IC Packaging

本文針對超快雷射用於半導體封裝過程中的異質材料進行一系列微加工實驗，並 針對實驗結果進行可行性評估。本研究所使用的主要異質材料包括白色環氧樹酯（以下簡稱EMC, Epoxy Molding Compound）、聚醯亞胺（以下簡稱PI, Polyimide）及厚度約0.36 mm的印刷電路板（以下簡稱PCB）。本實驗使用超快雷射之目的為去除EMC以及PI與PCB之間的殘膠，研究結果發現PI具有整體較佳之加工品質，基板完整沒有明顯的破壞；PCB因具有一定的吸收率故其整體加工品質次之；而EMC吸收率在三者中相對較差，故加工品質較不理想。實驗結果亦顯示雷射加工有機材料的熱殘留影響相當少，不會有燃燒現象。

This paper conducts a series of experiments to verify the feasibilities of ultrafast laser on the micromachining of IC packaging materials that consists of Epoxy molding compound (EMC), Polymide (PI), and printed circuit board (PCB) with 0.36 mm in thickness. The objectives of ultrafast laser are primarily used to remove the adhesive glue bonded between PCB and EMC as well as PI. The results indicate PI has the best overall qualities after machining since the substrate shows little to no damage, PCB comes in second with better absorptions, while EMC shows the least absorptions between the three. The results also show the organic materials after laser machining display very little thermal effects, and no obvious burning marks are found.