英文摘要 |
In this paper, the back-side microstructure and side-emitting lightguidereflective cup of GaN-based light emitting diodes (LEDs) werestudied and fabricated. Using precise electroplating technology tofabricate a thermal dissipation structure, the heat created from the LEDjunction can be directly dissipated by copper due to its high thermalconductivity (400 W/m ⋅ K). Bowl-shaped or cup-shaped reflectors can be also obtained to enhance the LED intensity and control LED lightpatterns.In addition, the LEDs with thermal dissipating structure do not needany adhesives, but can be directly fabricated with thermal dissipation andreflection cup functions on the back-sides of LED chips. As a result heatcan be derived directly and change the light patterns. Finally, the LEDsused in these experiments were produced using maskless, self-aligningprocesses. These methods may improve the thermal and optical quality ofhigh-power LEDs. |