應用於晶圓級氣體感測器之高效能點測設備開發

Development of a Probing Equipment with High Throughput for Wafer-based Gas Sensors

量測設備可提供在晶圓階段的氣體感測器晶粒的高效能電性量測，不需經封裝製程即可得知每顆氣體感測器之性能與品質，可大幅縮短感測器開發的試驗週期及有效提高整體生產效能。系統設備整合（1）可導入多種不同氣體成分及提供不同濃度之真空腔供氣系統；（2）自動光學對位系統；（3）線陣列探針點測裝置；（4）整合加熱裝置的晶圓吸盤等設計。可提供具有高效能之晶圓級氣體感測器的電性點測與品質分級，以1×1 mm晶粒的6＂晶圓（約17.6 K顆）為例，量測設備可在30分鐘內完成電性量測（點測10顆／次），其點測效能為現有市售設備（點測1顆／次）的10倍以上。

This measuring equipment can provide the electrical measurement with high throughput for wafer-based gas sensors to evaluate the quality and performance of sensor chips before packaging processes. Thus the experimental period can be reduced significantly and the production efficiency can be enhanced. The equipment integrated: (1) a chamber-based testing and gas supply system to provide required ingredients and concentrations of test gases; (2) an automatic optical registration system; (3) a linear probes device; (4) a chuck table integrated with a heating control module, to evaluate and classify gas sensors efficiently. For a 6＂-wafer with chip size of 1 × 1mm (about 17.6 K chips), electric measurement could be completed within 30 minutes by using linear probing device with 10 sets of probes. The measuring efficiency was at least up to 10 times greater than the one of one by one testing for packaged sensors.