溶膠凝膠薄膜在金屬基材上之防蝕研究

Study of Sol-gel Coating on Metal Substrate

本研究係探討溶膠-凝膠薄膜在銅合金基材上的防蝕行為，溶膠-凝膠薄膜乃以㆕㆚氧基矽烷（TEOS）為鍍膜前驅物進行水解反應後，以浸鍍（Dip coating）方式施鍍於金屬基材上，經乾燥後探討金屬基材之耐蝕性及電化學腐蝕行為。以恆電位儀量測金屬基材在3% NaCl水溶液中之極化曲線，可發現經以溶膠凝膠處理後之金屬基材之腐蝕電流比原先金屬基材更小，顯示具有較佳之耐蝕特性。此外，以電子顯微鏡（SEM）觀察表面及表面輪廓儀（Profilemeter）量測薄膜厚度。

In this study, sol-gel thin film is coated on copper alloys, the sol-gel thin film precursor is TEOS hydrolysis with aqueous solution. Sol-gel thin film is coated on metal substrates by dip coater then dry in oven. From the result of salt spray test and electrochemical analysis, it could be found the coated copper alloys have better anti-corrosion effect than bare copper alloys in 5% NaCl solution. Furthermore, the thin film thickness is measured by SEM and profile mete.