應用穩建化工程於玻璃無電鍍鎳前處理製程參數之研究

A Parametric Study of Nickel Deposition on Pretreatment of Glass Using Robust Engineering

本研究利用穩健化設計工程探討玻璃表面施行無電鍍鎳之前的蝕刻處理對表面形態及鍍層附著力的影響。規劃中的操作變因包括：氫氟酸（HF）、氟化銨（NH4F）、氟化鈉（NaF）、硝酸（HNO3）、硝酸鉀（KNO3）之濃度及蝕刻時間、蝕刻溫度等八項。由實驗結果得知，在預先界定的範圍之內，最佳的表面處理條件為HF濃度4g/l、NH4F濃度15g/l、NaF濃度9g/l、HNO3 濃度4ml/l、KNO3濃度5g/l、溫度60℃及蝕刻時間15分鐘。該處理條件之下所得的無電鍍鎳層之附著力提高，重量損失及表面粗糙度將會下降，如此可符合後續電鑄之要求。

A robust design method was adopted to study the effects of etching condition on the adhesivity of the electroless nickel deposition on glass. The controlling factors were concentration of KCl, NaF, NH4F, HF, HNO3, etching time and etching temperature. Under the preselected quantative level of each variable, the promotion of adhesion strength, reducing of weight loss and roughness were obtained at a pretreatment condition of 60℃ and 15min, in a solution consisting of 4 g/l HF, 15 g/l NH4F, 9 g/l NaF, 4 ml/l HNO3, 5 g/l KNO3. We can achieve the request of after-electroforming in this condition.