英文摘要 |
Semiconductor integrated circuit manufacturing processes utilize and generate numerous hazardous chemicals. Emission of those chemicals may affect worker’s health and /or causes wafer defect. Canister GC/MS method and a transportable auto-sampling GC/MS were utilized to investigate the airborne chemicals and by-products of work place, tool maintenance process and effluent; of treatment devices in a semiconductor factory. Most of airborne chemicals are at sub-ppm concentration levels during normal operations in the clean room. Isopropanol and acetone are the major volatile organics, and they may reach over ppm level. Frequent tool’s maintenance might result that the total hydrocarbon concentration of etching area was higher than other process area in this study. Meanwhile, airborne benzene and 2- methoxy-2-methylpropane of cleanroom were mainly contributed by the outdoor vehicular effluents. Hydrogen cyanide and chlorocyanide , the by products of plasma clean process, were found over permissible exposure levels during preventive maintenance of some metal etchers. While, carcinogenical compounds of chloroform and tetrachloromethane were also found. Thereforce necessary protective measurements should be enforced to reduce worker’s exposures for such preventive maintenance process. |