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篇名
以科學園區某半導體廠為例,分析製造設備用安全指引SEMIS2-93A施行前後之相對風險比較
並列篇名
Comparison of Relative Risk before and after the Implementation of SEMI S2-93A: a Case Study
作者 田效文鍾宜展黃國基
中文摘要
本研究是針對新竹科學園區,半導體 A廠共 147 種類型機台進行製程安全分析評估,進而評估半導體製造設備用安全指引(SEMI S2-93A) 規範施行前後設備風險比較,以做為安全衛生改善之依據。本研究之進行步驟首先為初步危害分析、其次為細部製程安全評估(危害與可操作性分析,HAZOP),最後為 SEMI S2-93A施行前後機台的風險比較。在 A廠的初步危害分析結果,有 21.77%之受評機台被評為具有高度風險,以擴散部門所佔的百分比為最高;而後增加依勞動檢查法第 26 條危險性工作場所審查與檢查所規範的類型機台(使用 HF、HCL等化學物品並經初步危害分析評定為高度危害之機台)進行細部製程分析評估。將 A 廠進行細部製程安全評估的機台區分為西元 1993 年以前及 1993 年以後製造兩個族群,進行第三部分的評估。由嚴重性與可能性與實際意外事故(SEMI S2-93A 施行前後比較)的分析數據發現:半導體製造設備用安全指引(SEMI S2-93A)的施行,確實可減少危害發生的嚴重性與可能性。
英文摘要
The objective of this study is to evaluate the equipment risk before and after the implementation of SEMI S2-93A and to provide a guideline for safety improvement. The studied semiconductor plant has a total of 147 manufacturing equipment all of that were included for the risk assessment. This study was carried out in three steps, namely preliminary hazard analysis, detailed process safety evaluation using HAZOP, and the equipment risk comparison before and after the implementation of SEMI S2-93A. Results of the preliminary hazard analysis show that 21.77% of the manufacturing equipment are ranked as high, with the largest percentage coming from the dispersion process. The second analysis was conducted for those equipment types specified by Article 26, the hazardous workplace review and inspection law, of the Labor Inspection Law. Equipment using hazardous chemicals such as SiH4, HF, HCl, etc. and that identified to be highly hazardous with the preliminary hazard analysis were subject to the detailed process analysis and evaluation. In the third part of evaluation, the equipment used for detailed process safety assessment was divided into two groups based on the manufacturing date before and after 1993. From the results of severity, possibility, and actual accident analysis by comparing before and after the implementation of SEMI S2-93A, it is clear that the adoption of SEMI S2-93A can certainly reduce the severity and possibility of the occurrence of hazardous events.
起訖頁 207-217
關鍵詞 半導體風險HAZOPSEMI S2-93ASemiconductorRiskHAZOPSEMI S2-93A
刊名 勞工安全衛生研究季刊  
期數 200209 (10:3期)
出版單位 行政院勞動部勞動及職業安全衛生研究所
該期刊-上一篇 空氣中胺基甲酸鹽類農藥同時檢測方法之建立
該期刊-下一篇 工業用機器人安全防護系統與乙太網路之整合應用與探討
 

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