In的添加對於Sn-2.5Bi之性質的影響

The Influence of Indium Addition on The Properties of Sn-2.5Bi Alloy

本研究於Sn-2.5Bi合金中添加3 wt.% In元素，以期降低其熔點並提升其機械與熱性質。實驗結果顯示，In的加入可將Sn-2.5Bi合金的熔點由228°C進一步降低至223°C，且顯著提升材料硬度。微觀組織分析指出，Sn-2.5Bi主要透過固溶硬化機制進行強化，而In的加入進一步強化此固溶硬化效應，使合金硬度由原本的9 HV提升至18 HV。進一步觀察時效處理後的硬度變化，可發現In的添加使合金展現出與未添加時不同的時效趨勢。初步結果顯示，In元素有助於改變Sn-2.5Bi合金的微觀結構穩定性，並增強其時效強化效應。綜合而言，本研究初步揭示了In對Sn-Bi合金強化機制的影響，對於開發具備優異性能之低溫銲料具有重要參考價值。

In this study, 3 wt.% of indium (In) was added to a Sn-2.5Bi alloy to lower its melting point and enhance its mechanical and thermal properties. The experimental results showed that the addition of In reduced the melting point of Sn-2.5Bi from 228°C to 223°C and significantly improved the hardness of the material. Microstructural analysis revealed that Sn-2.5Bi was primarily strengthened through a solid-solution hardening mechanism, and the incorporation of In further enhanced this effect, increasing the hardness from 9 HV to 18 HV. Moreover, the hardness variation after aging treatment exhibited a different trend with In addition. Preliminary findings suggest that In addition alters the microstructural stability of Sn-2.5Bi and enhances its aging strengthening behavior. Overall, this study provides initial insights into the strengthening mechanisms of In in Sn-Bi alloys, offering valuable guidance for the development of high-performance, low-temperature solder materials.