| 英文摘要 |
This study focuses on the design, fabrication, and property evaluation of two low-melting quaternary principal alloy systems—AlBiSnZn (ABSZ) and BiInSnZn (BISZ)—to explore their potential for low-temperature electronic joining applications. Differential scanning calorimetry (DSC), field-emission scanning electron microscopy (FE-SEM), X-ray diffraction (XRD), and tensile testing were employed to systematically investigate their melting behavior, microstructures, and mechanical properties. The results indicate that both alloys exhibit multiphase structures rather than the single-phase solid solutions typically observed in high-entropy alloys. While the multiphase nature contributes to enhanced hardness and thermal stability, both ABSZ and BISZ show pronounced brittleness, with tensile elongation limited to only 3–5%. Notably, despite the presence of high-melting-point aluminum in ABSZ, the alloy's melting point remains as low as 128°C, suggesting limited influence from aluminum on melting behavior. BISZ, on the other hand, demonstrates a favorable low melting point and a stable multiphase structure. Overall, the formation of single-phase high-entropy-like structures in low-melting alloys remains challenging, highlighting the need for further optimization through compositional design and microstructural control strategies. |