熱處理對平面顯示器用鋁合金薄膜特性之研究

本研究使用鋁鈧（Al-Sc）、鋁釹（Al-Nd）合金靶材作為濺鍍源，利用濺鍍方式沈積薄膜後，觀察合金薄膜於熱處理前後之顯微組織及薄膜物性量測研究，實驗顯示Al-Sc合金薄膜於熱處理前、後之粗糙度（Ra）比Al-Nd合金薄膜小，相對來說突起物（Hillock）也較少，因此Al-Sc合金應用在平面顯示器之導線上，能有效降低短路情形。電阻值方面，Al-Sc合金薄膜在熱處理前比Al-Nd合金薄膜低，經過熱處理後兩合金薄膜之電阻值皆有下降的趨勢，其中Al-Nd合金薄膜之電阻值降幅較Al-Sc合金薄膜大；在熱傳導方面，Al-Sc合金薄膜較不隨熱處理溫度變化而劇烈改變，此表示Al-Sc合金薄膜對熱的穩定性較佳，能滿足平面顯示器驅動電路導線要求。

The purpose of this research is mainly focusing on the characteristics study of the sputtering Al-Sc and Al-Nd alloy thin films. The films, made by the spotted coating method, are laid the interconnections of TFT-LCDs. This study investigates the influence of heat-treatment, with temperatures from 250°C to 400°C, on microstructure and physic property of deposit alloy thin films. Experiment shows that, after the heat treatment, the roughness of the Al-Sc alloy membrane is less than that of the Al-Nd alloy, and the hillock is comparatively less. Therefore, the component failure rate is predicated less. The resistivity of the Al-Sc thin film is less than the Al-Nd thin film before heat treatment and both resistivity values are effectively reduced after heat treatment, even though the reduced range of resistivity for Al-Nd is larger than the value of Al-Sc alloy membrane. In other words, the resistivity of Al-Sc thin film in thermal stability is better than Al-Nd thin film. Experiment shows Al-Sc alloy is more appropriate used as the driving circuit leads wire material of TFT-LCDs.