COG Bonding失效之改善過程探討

Explore the Process of Improvement COG Bonding Failure

玻璃覆晶（Chip On Glass, COG）是一種將IC晶片透過異方性導電膠（Anisotropic Conductive Film, ACF）接合於LCD上的導通技術，是中小尺寸液晶顯示器（Thin Film Transistor-Liquid Crystal Display, TFT-LCD）常用的一種接合技術，因不需要用到捲帶，不但成本降低，亦可簡化製程，實現了生產效率的提升，符合液晶顯示器產品輕、薄的需求。控制玻璃覆晶主要條件為溫度、壓力及時間，然而隨著IC晶片長度及異方性導電膠的廠商不同，所需製程條件也不同，IC晶片翹曲所造成品質問題就是由此衍生出來的，近年台灣液晶顯示器產業高度發展，具有高競爭力及成長潛力，要在液晶顯示器產業佔有一席之地，品質是一個關鍵，田口方法（Taguchi Methods）是一種有效的穩健性優化設計方法，用直交表來進行確認實驗，本研究主要以田口方法探討改善COG可靠度之Bonding條件組合，經由確認實驗之結果顯示 ，透過改善後之製程參數組合設定，可降低IC晶片翹曲發生率，提高COG Bonding良率。

The COG is an IC through the ACF bonding technology on the LCD, the COG is a commonly used small and medium-sized LCD display bonding technology, by eliminating the need to use tape, not only reduce costs, also simplify the process, etc., achieve productivity improvement. The COG structure meets the needs of light and thin LCD products, the main control bonding conditions for temperature, pressure and time, however, different length IC and ACF Manufacturer, the required process conditions will be different. IC warpage is the main cause of quality problems, Taiwan's LCD industry highly developed, with high competitiveness and growth potential, quality is the key to the development of LCD industry. Taguchi method is an efficient design methodology and confirm experiments the use of orthogonal array. Taguchi method is used in this study to analyze the conditions combination of Bonding and enhance reliability of COG, confirmed by the results of experiments, through a combination of improved process of setting parameters, to reduce the incidence of IC warpage, improve COG bonding yield.