田口方法在Chip on Film引脚壓合成型精度改善之應用

Applied Taguchi Method to Improve Lead Bonding Accuracy of Chip on Film

本研究目的是應用田口品質工程方法，探討晶粒軟膜接合（Chip on Film；COF） 封裝技術中有關內引脚壓合製程（Inner Lead Bonding Process；ILB）過程中，相關製程參數設定對於內引脚成型時共平面度不良的影響。本文提出以不同壓合時間、壓合力量下的引腳及凸塊應力分佈狀況，以模擬分析獲得時間與壓力之壓合參數最佳化設計。依據實驗後數據資料分析結果，經由田口品質工程方法得知在壓合過程中壓合壓力（Bonding Force）、壓合時間（Bonding Time）等參數都會直接影響引腳與凸塊接合後的良率。

The purpose of this study is to explore the effect of co-planarity during Inner Lead Bonding (ILB) Process of Chip on Film (COF) assembly technology process by Taguchi method. This study claims that different bonding time and force cause stress distribution of lead and bump and learn the best bonding parameters of bonding time and force by simulation analysis. Finally, the analysis result use Taguchi method again to verify that the parameters during bonding process, Bonding Force and Bonding Time, will directly influence the yield rate of connecting lead and bump.