半導體晶圓表面清洗技術發展

Development of Semiconductor Wafer Surface Cleaning Technology

半導體製造業利用微污染控制發展有效清洗技術，使半導體產品不受微粒污染以改善產率、減少成本及避免危害工作人員健康，是當前重要研究課題。目前在半導體廠清除晶圓表面微粒、金屬與有機物仍以濕式化㈻清洗法為大㊪，不可避免的會產生去離子水及化㈻品大量使用的情形，而會有廢棄物丟棄及人員健康危害的問題發生，且不能符合下世代晶圓製程整合（cluster tool）的概念，因此乾式清洗技術正被積極發展以符合清潔生產、加強良率並符合製程整合的概念。在目前的乾式去除微粒的技術中，利用含氣膠微粒的低溫高速氣流、高速氣流和雷射輔助清除晶圓上的微粒為目前研究最廣的技術。有些乾式清洗技術已在半導體製程測試過或者已被採用。本篇論文針對這些清洗技術及其在半導體製程的應用做一有系統的文獻回顧。

Developing effective microcontamination control technology to increase product yield, reduce production cost, and protect employee’s health is a critical issue in the semiconductor manufacturing industry. Currently, wet-chemical cleaning method has been mostly employed to remove particulate, metal and organic compounds deposited on wafer surface. However, the mass usage of de-ionized water and chemical compounds during wet-chemical cleaning process has created a big concern about chemical waste treatment and employee health hazard issues. In addition, the wetchemical cleaning method can not meet the need for the next generation of semiconductor manufacturing due to the need of the full-scale process integration (cluster tool). Therefore, a dry cleaning tool system is eagerly pursued to meet the concept of cleaner production, yield increase and cluster tool integration. Several important dry particle-cleaning technologies have been published or become commercially available. They are CryoKinetic aerosol cleaning, air-flow cleaning and laser-assisted cleaning. Few commercial dry cleaning tools have also been tested and adopted in different semiconductor manufacturing processes. This paper is a review about the wafer cleaning technology and its applications in semiconductor manufacturing.