Sn-Ag-Sb-Cu無鉛銲點附著強度與應變率敏感度的研究

Study of Adhesive Strength and Strain Rate Sensitivity of Sn-Ag-Sb-Cu Lead-free Solder Joints

本研究為探討Sn-3wt%Ag-1.5wt%Sb-xCu無鉛銲點在不同應變率(10-3s-1~1s-1)與150℃不同熱儲存時間(0hr~600hr)下的附著強度與應變率敏感度的變化。研究顯示每一銲點的附著強度隨應變率的降低而減少。銲接後的Sn-3Ag-1.5Sb-xCu銲點，附著強度隨Cu含量的增加而增大。經熱儲存的銲點，附著強度在熱儲存前200小時，隨儲存時間的增加而降低。過了200小時，附著強度受時間的影響就不大。同一熱儲存條件下的銲點，在Cu含量大於1.0wt%時，附著強度會隨Cu含量的增加而降低，惟在200小時以後不同Cu含量的銲點附著強度就差別不大。Sn-3Ag-1.5Sb-xCu銲點的應變率敏感度m 受熱儲存時間的影響不大，而Sn-3.5Ag的m值與Sn-3Ag-1.5Sb-xCu相比，會隨熱儲存時間的增加而增大。

This study investigates the influence of strain rate on the adhesive strength and the strain rate sensitivity of the as-soldered Sn-3Ag-1.5Sb-xCu solder joints and following thermal storage for different times at 150℃. The adhesive strength of the as-soldered Sn-3Ag-1.5Sb-xCu solder joints increases with Cu addition. The adhesive strength decreases with increasing time of thermal storage before 200 hours, nevertheless the reduction tends to be small after 200 hours. For Cu additions of 1.0wt% or higher and the same time of thermal storage, the adhesive strength decreases with Cu addition, however the adhesive strength difference among Cu addition tends to be small after 200 hours of thermal storage. The effect of the time of thermal storage on strain rate sensitivity (m) of the Sn-3Ag-1.5Sb-xCu solder joints is small. And the m values of Sn-3.5Ag, compared with Sn-3Ag-1.5Sb-xCu, increase with increasing time of thermal storage at 150℃.