Sn-3.5Ag錫基合金於銅與鎳基材之潤濕性、界面反應與微觀結構探討

Exploring Wettability Interfacial Reactions and Microstructures of Sn-3.5Ag on Cu and Ni

本研究探討Sn-3.5Ag（SA3.5）銲料在銅（Cu）與鎳（Ni）基材上的介面反應行為。結果顯示，靠近SA3.5/Cu介面的錫晶粒尺寸（14.5μm）顯著大於SA3.5/Ni介面（4.5μm）。SA3.5銲料在兩種基材上皆展現良好潤濕性，且在Ni上的潤濕性更佳。透過密度泛函理論（DFT）計算的介面能結果亦與此相符，其中SA3.5/Ni的介面能為0.25J/m²，低於SA3.5/Cu的0.54 J/m²。本研究成果有助於深入理解SA3.5銲料在Cu與Ni基材上的微觀結構、潤濕性與介面能行為。

This study demonstrates the interfacial reactions of Sn-3.5Ag (SA3.5) solder on Cu and Ni. The Sn grain size near the SA3.5/Cu interface (14.5μm) is significantly larger than the SA3.5/Ni interface (4.5μm). SA3.5 possesses favorable wettability on both substrates, with better wetting on Ni. Calculated interfacial energies support these findings, with lower interfacial energy for SA3.5/Ni (0.25 J/m2) than SA3.5/Cu (0.54 J/m2) calculated by Density-functional theory (DFT). The findings enhance our understanding of the microstructure, wettability, and interfacial energy of SA3.5 solder on Cu and Ni.