以濺鍍方式在電子產品的塑膠外殼上披覆金屬薄膜以達到電磁波干擾遮蔽之效果

本實驗主要以磁控式真空濺鍍方式在電子產品的塑膠外殼內層披覆上一層金屬薄膜，膜厚控制在0.5µm左右，利用磁控式真空濺鍍的金屬薄膜具有高導電性質、金屬原子沉積後的膜層表面緻密性高、製程溫度低、鍍膜後產品組裝較容易而且製程環保無汙染等特性，來達到符合電子產品需要高速運轉、高頻計算而容易產生較高能量之電磁波的情形下，也能產生高抗電磁波干擾（Electrical Magnetic Interference）的效果，使得電磁波無法對電子產品的正常運作產生影響。

Our experiments are focused on depositing metal thin film by sputtering system. The thickness of metal thin films is About 0.5µm. Using metal thin film to shield EMI have some remarkable characteristics, such as high conduct ability, high density films, producing with low temperature, no pollution, and easier for sequent packaging. High EMI shielding effect can protect IT produces form EM wave damage from high speed working and high frequency calculating process.