疊紋光學量測法介紹

Introduction of Moirė Method and Application

隨著科技的持續發展，相關檢測尺度越來越微小，越來越精密。因此，相關量測技術逐漸從傳統的接觸式量測轉變為光學的非接觸式量測技術。光學量測技術具有非接觸、全場性、速度快與高精密等優勢，除了運用於傳統的領域外，同時運用在高科技領域，如半導體工業、微機電系統、微奈米科技、生醫技術等研發及製程上。此外，除了具有非接觸式與非破壞性檢測的特點外，更具有不易與量測環境發生作用產生危險以及應用範圍廣的優點，目前廣泛應用在工程上應力、應變與產品表面形貌的分析量測，是一項非常重要的技術。光學量測技術總類相當多，本文主要著重於疊紋（Moirė）量測技術介紹，依據目前主流技術發展其疊紋技術包含幾何疊紋法（Geometric Moirė）、陰影疊紋（Shadow Moirė）、疊紋干涉儀（Moirė Interferometry）、投射疊紋（Projection Moirė）、與Sampling Moirė等，其介紹內容包含量測原理、發展趨勢、應用領域及未來技術發展等，期望透過本文的說明介紹，能夠對疊紋技術有更深一層的了解。

The detection scales are getting smaller and more precise with the development of science and technology. Therefore, the measurement technology has gradually changed from traditional contact measurement to optical non-contact measurement technology. As representative non-contact optical techniques, Moire methods have been extensively used to visualize deformation distributions of materials, arrangements of structures, and shape features of objects in research and industrial fields. This paper focuses on the introduction of Moirė measurement technology including Geometric Moirė, Shadow Moirė, Moirė Interferometry, Projection Moirė, and Sampling Moirė. The Moirė techniques are promoted by the demands of high-accuracy, multi-scale, extremely small- or large-scale, high-temperature, dynamic, on-line measurements and three-dimensional.