Board Level Reliability of IC Package Under Thermal Cycling Process(2001)

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The mechanical reliability of Chip Scale Packages(CSP,) as used in surface mount, is of primary concern. Substrate on Chip(SOC) is one of the package types of CSP. SOCs offer high circuit density, a lighter weight, increased circuit speed and are easy to surface mount by solder ball joint. In this project, the package warpage and fatigue life in solder ball joints under cyclic loads are studied.