應用消色影像分析技術評估粒片板之內聚強度

Apply Fade Effective Image Processing Analysis Technique to Evaluate Internal Bond Strength of Particleboard

商用木質粒片，經4種不同網目之篩網篩分後使用之，抄製成相同密度之粒片板。並再以相同粒片尺寸及不同密度等組合製成試驗用粒片板。切製成5 × 5 cm 試片，經由測定內聚強度後，使用所設計之消色影像分析（fade effective image processing analysis, FEIPA）技術評估其破壞面之內部膠合面積（internal bonded areas）。再以立體顯微鏡觀察破壞面之顯微外觀作對照。藉以分析粒片板組成因子對內聚強度之影響。試驗結果顯示，所製成之粒片板中具較大粒片者，因其膠合面積較小，於相同用膠量下，相對之布膠量較高，則得較高之內聚強度，而較小粒片者，則得到相反結果。又知，較高密度之粒片板，熱壓過程使粒片板產生較高之緻密化，導致膠合面積增多，相對提高粒片板之內聚強度。因此應用FEIPA 技術能有效分析粒片板破壞面之膠合面積大小與內聚力兩者間之關係。 Commercial wood particles, screened at 4 particle sizes, were prepared for producing particleboard specimens made of each particle size with a constant density and board manufactured at 3 different densities from the same particle size. After the internal bond strengths were tested, the designed method of the fade effective image processing analysis (FEIPA) was used for measuring the internal bonded areas in particleboard specimens. The micrograph viewpoint on the fracture appearances was observed using a stereoscopic microscopic examination to determine fracture conditions for evaluating the influence of internal structural factors on the internal bond strength of particleboard. Results indicated that for greater the internal bond strength at the same amount of resin content, larger particle sizes with smaller bonded areas or greater density with smaller voids and a fewer number of discontinuities are required. Moreover, a particleboard specimen manufactured with a higher density formed a higher panel densification during the hot pressing. This was resulted in a greater number of bonded areas among the particles, as well as the increased in the internal bond strength relatively. Using the FEIPA to measure the internal bonded areas in particleboard combined with fracture portions observations could provide an experimental data for referencing the internal bond state of particleboards.

Commercial wood particles, screened at 4 particle sizes, were prepared for producing particleboard specimens made of each particle size with a constant density and board manufactured at 3 different densities from the same particle size. After the internal bond strengths were tested, the designed method of the fade effective image processing analysis (FEIPA) was used for measuring the internal bonded areas in particleboard specimens. The micrograph viewpoint on the fracture appearances was observed using a stereoscopic microscopic examination to determine fracture conditions for evaluating the influence of internal structural factors on the internal bond strength of particleboard. Results indicated that for greater the internal bond strength at the same amount of resin content, larger particle sizes with smaller bonded areas or greater density with smaller voids and a fewer number of discontinuities are required. Moreover, a particleboard specimen manufactured with a higher density formed a higher panel densification during the hot pressing. This was resulted in a greater number of bonded areas among the particles, as well as the increased in the internal bond strength relatively. Using the FEIPA to measure the internal bonded areas in particleboard combined with fracture portions observations could provide an experimental data for referencing the internal bond state of particleboards.