應用於車用晶片系統之高速電路板電磁相容技術分析與設計

Analysis and Design of High-Speed PCB EMC Techniques for Vehicular Integrated Circuit Systems

在現今科技發展下，電路板設計不再是將訊號線正確連接這麼單純，而印刷電路板上的電磁相容成為必須要考量之因素，整合印刷電路板上各種不同種類的信號使各信號不會互相干擾。本文採用經濟部九十九年電磁相容 （EMC）設計競賽所提供的電路圖，進行電路分析並且依照各元件的規格書來區分元件特性，以利在印刷電路板佈局時可規劃各元件的最佳擺放位置，並採用電磁相容設計準則應用於電路佈局，並且使用日本NEC 所開發的EMIStream 模擬軟體進行系統模擬，在設計初期就將EMC 問題納入考量，使設計能符合國際規範及一般工業標準電子產品規範的可能性。

In today’s technological environment, circuit board designs no longerjust simply connect signal lines. We need to consider the issue ofelectromagnetic compatibility on PCB boards to prevent different types ofsignals from interfering with each other. This study is in accordance withthe circuit provided by the 99 EMC design competition. With circuitanalysis and the specification of each component device, the optionalposition of each component on the PCB board can be made. Moreover,with the EMC design guidelines for circuit layout and the EMIStream forsystem simulation, this design achieves the standards of general industryelectronics for electronic products.