英文摘要 |
In-Mold Decoration (IMD) is a new plastic decoration technology, which has the advantages of reducing the product follow-up decoration processes, such as thermal transfer, printing, spraying, electroplating etc. Moreover, the film scour and shear stress defects are common problems which are caused by cooling non-uniform in the plastic material filling process. This study was using mold flow analysis to solve forming problem in the IMD process. In addition, the Taguchi method was used to evaluate the warpage problem in order to maximize the process parameters. From the analysis results, we found that main process parameters for warpage were the packing time, cooling time and packing segments. |